| 1. | Comparative tracking index v
相比漏电起痕指数v |
| 2. | Test method for comparative tracking index of electrical insulating materials
电绝缘材料的比较跟踪系数的试验方法 |
| 3. | Comparative tracking index
相比漏电起痕指数v |
| 4. | Comparative tracking index
比较性漏电指数 |
| 5. | Standard test method for comparative tracking index of electrical insulating materials
电绝缘材料比较漏电痕迹指数的标准试验方法 |
| 6. | Method for the determination of the proof and the comparative tracking indices of solid insulating materials
固体绝缘材料的比较起痕指数和耐起痕指数的测定方法 |
| 7. | Method for the determination of the proof and the comparative tracking indices of solid insulating materials
固体绝缘材料的耐泄痕指数和比较起痕指数的测定方法 |
| 8. | Method for the determination of the proof and the comparative tracking indices of solid insulating materials ; corrigendum 2
固体绝缘材料的比较起痕指数和耐起痕指数的测定方法 |
| 9. | Method for the determination of the proof and the comparative tracking indices of solid insulating materials iec 60112 : 2003 ; german version en 60112 : 2003
固体绝缘材料的耐起痕指数和比较起痕指数的测定方法 |
| 10. | By reducing bromine content and adding aluminum hydroxide in the surface of substrate for the printed circuit board , comparative tracking index ( cti ) of the substrate is improved significantly , meanwhile the size stability , heat resistance , the glass transition temperature of the substrate are improved too
摘要通过降低印制电路板的基板表层的嗅含量并加入氢氧化铝，显著提高了基板的相比漏电起痕指数( cti ) ，并同时提高了基板的尺寸稳定性、耐热性、玻璃化温度。 |
